TSMC Fabs - Taiwan Semiconductor Manufacturing Company …
TSMC operates four 12-inch wafer GIGAFAB® fabs, four 8-inch wafer fabs, and one 6-inch wafer fab – all in Taiwan – as well as one 12-inch wafer fab at a wholly owned subsidiary, TSMC Nanjing Company Limited, and two 8-inch wafer fabs at wholly owned subsidiaries, TSMC Washington in the United States, and TSMC China Company Limited.
TSMC's System-on-Wafer Platform Goes 3D: CoW-SoW Stacks Up ... - AnandTech
Apr 26, 2024 · TSMC has been offering its System-on-Wafer integration technology, InFO-SoW, since 2020. For now, only Cerebras and Tesla have developed wafer scale processor designs using it, as while they...
InFO (Integrated Fan-Out) Wafer Level Packaging - TSMC
InFO_PoP, the industry's 1st 3D wafer level fan-out package, features high density RDL and TIV to integrate mobile AP w/ DRAM package stacking for mobile application. Comparing to FC_PoP, InFO_PoP has a thinner profile and better electrical and thermal performances because of no organic substrate and C4 bump.
TSMC's 2nm process will reportedly get another price hike — …
Oct 4, 2024 · TSMC's quote for a 300-mm wafer process using its N2 technology will exceed $30,000, according to the report. Previously it was expected that world's largest contract maker of chips will charge...
Integrated Fan-Out (InFO) Wafer Level Packaging - TSMC
InFO-PoP, the industry’s first 3D wafer-level fan-out package, features a high density RDL and TIVs to integrate mobile application processors with dynamic random access memory (DRAM). InFO-PoP has better electrical and thermal performance, and a thinner profile than flip chip package-on-package, because it has no organic substrate or C4 bump.
Taiwan Semiconductor Manufacturing Company Limited - TSMC
Maintaining reliable production capacity is a key manufacturing strategy at TSMC. The Company currently operates four 12-inch GIGAFAB ® facilities – Fab 12, 14, 15 and 18. The combined capacity of the four facilities exceeded 12 million 12-inch wafers in 2023.
TSMC Outlines Path to EUV Success: More Tools, More Wafers,
May 17, 2024 · TSMC says that it has managed to increase wafer-per-day-per-tool productivity of its EUV systems by two times since 2019. To do so, the company optimized the EUV exposure dose and the...
How TSMC killed 450mm wafers for fear of Intel • The Register
Aug 8, 2022 · A former TSMC executive has described how a collaborative effort towards 450mm (18-inch) wafers for manufacturing chips was halted when the company realized it would put them in direct competition with Intel and Samsung.
TSMC explores using 510x515 mm rectangular silicon wafers — …
Jun 20, 2024 · Instead of 300mm diameter wafers, TSMC's new method reportedly uses rectangular substrates measuring 510mm by 515mm. These panels offer a usable area approximately 3.7x larger than traditional...
TSMC to go 3D with wafer-sized processors - Tom's Hardware
Apr 26, 2024 · TSMC is taking the wafer-scale fabrication battle into the third dimension with a new technology. At its North American Technology Symposium, the company introduced its next-generation...