Intel has a new architecture roadmap and a plan to retake its ...
2021年7月26日 · • Intel 7 is the new name for what would have been Intel’s third-generation 10nm technology and the successor to Intel’s 10nm SuperFin (aka Intel’s second-generation 10nm chips, found...
Intel's process roadmap to 2025: Intel 7, 4, 3, 20A, and 18A …
2024年10月19日 · Intel 7 and Intel 4 have been completed, with Intel 3, 20A, and 18A coming in the next few years. Intel 7 is the company's 10nm process, and Intel 4 is its 7nm process. The names can be...
'Meteor Lake' Architecture Detailed: What to Know About Intel's …
2023年9月19日 · Intel's next-generation Meteor Lake is a rethink of how its processors are put together, now with a tile-based chiplet design that includes dedicated AI processing capabilities, a new kind of...
Intel's Process Roadmap to 2025: with 4nm, 3nm, 20A and 18A?! - AnandTech
2021年7月26日 · Alder Lake and Sapphire Rapids will now be known as Intel 7nm products, showcasing a 10-15% performance per watt gain over 10SF due to transistor optimizations.
Intel's 7nm PC Chip To Arrive in 2023 Next to TSMC-Made CPU
2021年3月24日 · When 2023 arrives, Intel will introduce its first 7nm chip for PCs. However, the product will arrive alongside another set of new Intel chips, except these will be manufactured by TSMC, the...
7 nm lithography process - WikiChip
2022年11月5日 · Nicknamed "Intel 7 Ultra" internally, the new process is a full PDK update over the one used by Alder Lake, their 3rd generation SuperFin Transistor architecture. Intel says this process brings transistors with significantly better channel mobility.
'Meteor Lake' First Tests: Intel Core Ultra 7 Benched for CPU ... - PCMag
2023年12月14日 · Intel’s next-generation “ Meteor Lake ” processors have arrived in laptops, bringing local artificial intelligence (AI) crunching silicon to mainstream mobile Windows 11 PCs through the chip...
Intel 4 Process Node In Detail: 2x Density Scaling, 20% Improved ...
2022年6月13日 · While Intel has managed to make something suitable of their 10nm process nodes – especially with their most recent 10nm Enhanced SuperFin variant, which we better know as Intel 7 – it’s not...
Intel’s Next Generation Packaging: EMIB and Foveros
2021年7月26日 · Intel’s EMIB technology is designed for chip-to-chip connections when laid out on a 2D plane. The easiest way for two chips on the same substrate to talk to each other is by taking a datapath...
2021年7月26日 · Providing an approximately 20% performance-per-watt1 increase over Intel 7, Intel 4 is the first Intel FinFET node to fully embrace extreme ultraviolet lithography (EUV), which involves a highly complex optical system of lenses and mirrors that focuses a 13.5nm wavelength of light to print incredibly small features on silicon.
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